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METHOD FOR FABRICATING MICROMACHINED STRUCTURES

Summary

A method for fabricating micromachined structures is provided. At least one cavity is formed on a substrate and then a dielectric material different from the material of the substrate is filled in the at least one cavity. Next, a circuitry layer including a first etch-resistant layer and a dielectric layer is formed above the at least one cavity filled with the dielectric material. A portion of the circuitry layer exposed by the first etch-resistant layer is then etched. Finally, the dielectric material in the at least one cavity is etched out.

Technology Benefits

It is an object of the present invention to provide a novel method for fabricating micromachined structures that etches both the circuitry layer and the dielectric material in the cavities of the substrate in one etching process.

Technology Application

manufacturing

Application Date

21-Nov-2007

Application No.

11/944,247

Coverage Areas

MEMS

Country/Region

USA

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