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METHOD FOR FABRICATING MICROMACHINED STRUCTURES

總結
A method for fabricating micromachined structures is provided. At least one cavity is formed on a substrate and then a dielectric material different from the material of the substrate is filled in the at least one cavity. Next, a circuitry layer including a first etch-resistant layer and a dielectric layer is formed above the at least one cavity filled with the dielectric material. A portion of the circuitry layer exposed by the first etch-resistant layer is then etched. Finally, the dielectric material in the at least one cavity is etched out.
技術優勢
It is an object of the present invention to provide a novel method for fabricating micromachined structures that etches both the circuitry layer and the dielectric material in the cavities of the substrate in one etching process.
技術應用
manufacturing
申請日期
21-Nov-2007
申請號碼
11/944,247
覆蓋範圍
MEMS
國家/地區
美國

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