The present disclosure provides a LED package structure and a LED light-emitting device. The LED package structure comprises a LED chip and a wavelength converting layer covering the LED chip. The wavelength converting layer contains red phosphor, which has lower amount in edge portion than in cente.....
[Detail]
A method for fabricating micromachined structures is provided. At least one cavity is formed on a substrate and then a dielectric material different from the material of the substrate is filled in the at least one cavity. Next, a circuitry layer including a first etch-resistant layer and a dielectri.....
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一種電路板，其具有至少一通孔，並包括一基板、一第一線路層、至少一接地柱、一第一保護層與多個頂接地墊；第一線路層配置在基板上，並包括至少一第一接地部；接地柱配置在基板中，並連接第一接地部；第一保護層覆蓋第一接地部；而通孔裸露於第一保護層；第一保護層具有至少一凸部與多個局部暴露第一接地部的第一開口；所述的第一開口圍繞通孔，而各個第一開口具有一邊緣；凸部從其中一邊緣凸出；所述的頂接地墊分別位在所述的第一開口內，並連接第一接地部；頂接地墊凸出於第一保護層的外表面，而凸部位在接地柱及其相鄰的頂接地墊之間。本實用新型提供一種電路板，其可以降低電磁干擾對電子產品的不良影響。
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