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Zero-footprint Metrology Microsystem

Technology Benefits

Can be used in hostile process environmentsAccurate data analysis can be collected with minimal effortForm-factor can vary from a stand-alone mot-sized device to a wafer with an arrayArray implementations could obtain accurate mapping information of process parameters at various lateral positions across wafersData acquisition is compatible with post-measurement data reading or in-situ wireless transmisison

Technology Application

Target applications include growth/etch processing of dielectric films and semiconductor films, chemical mechanical polishing (CMP), and curing of polymetric films (e.g. photoresist and low-k dielectrics).With appropriate modeling and calibration, refractive indexes and absorption monitoring could be expanded into broader applications including optical spectroscopy of processing chemistry.

Detailed Technology Description

None

Others

Related Technologies

Optimized Device And Analytical Methods For Measuring Properties Of Micro- And Nano- Scale Systems

Tech ID/UC Case

17662/2006-093-0

Related Cases

2006-093-0

Country/Region

USA

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