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Zero-footprint Metrology Microsystem


技术优势

Can be used in hostile process environmentsAccurate data analysis can be collected with minimal effortForm-factor can vary from a stand-alone mot-sized device to a wafer with an arrayArray implementations could obtain accurate mapping information of process parameters at various lateral positions across wafersData acquisition is compatible with post-measurement data reading or in-situ wireless transmisison


技术应用

Target applications include growth/etch processing of dielectric films and semiconductor films, chemical mechanical polishing (CMP), and curing of polymetric films (e.g. photoresist and low-k dielectrics).With appropriate modeling and calibration, refractive indexes and absorption monitoring could be expanded into broader applications including optical spectroscopy of processing chemistry.


详细技术说明

None


其他

Related Technologies


Tech ID/UC Case

17662/2006-093-0


Related Cases

2006-093-0


国家/地区

美国

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