A semiconductor element and a manufacturing method thereof are provided. The semiconductor element includes a substrate and multiple semiconductor chips disposed thereon. The semiconductor chips are arranged to form multiple sequentially nested circle(s), and a circumference of each of which is arra.....
[Detail]
A package substrate includes: an insulating substrate, a first and a second soldering pads spacedly disposed on a first surface of the insulating substrate, a first and a second electrodes spacedly disposed on an opposite second surface of the insulting substrate. The first and the second soldering .....
[Detail]
An optical touch device includes a transparent substrate and at least a light emitting and receiving unit. The transparent substrate has a touch surface, a first light incidence surface and a first light emitting surface. Each light emitting and receiving unit includes a linear light source, a light.....
[Detail]
The present invention relates to a computer system capable of adjusting the operating frequency dynamically and comprises at least a processor voltage-adjusting unit, a clock-generating circuit, at least a load-detecting unit, and a control unit. The processor voltage-adjusting unit and the clock-ge.....
[Detail]
A motion estimation method for a succession of frames in a digital coding system includes: with reference to a first block in a first frame, searching a second frame for a second block that corresponds to the first block; and estimating a motion vector of the first block with respect to the second b.....
[Detail]
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