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Thin Film Deposition System: Simultaneous Physical and Chemical Vapor Deposition

Technology Benefits: Simultaneous physical and chemical vapor deposition

Technology Application: Thin film deposition systems

Detailed Technology Description: A UCSC researcher has designed various architectures for a system by which physical and chemical vapor deposition are performed simultaneously or sequentially. This disruptive design will have a significate impact on thin film research communities, which will significantly benefit by this new system. Industry could potentially scale up this invention to design a system not currently commercially available.

Application No.: 20180002810

Others

Additional Technologies by these Inventors

Tech ID/UC Case

25617/2015-378-0

Related Cases

2015-378-0

*Abstract: Current commercial thin film deposition systems (e.g. sputtering and atomic layer deposition) allow for only one deposition mode in a single process environment, either physical vapor deposition (PVD) or chemical vapor deposition (CVD. It has been extremely rare, if ever accomplished, that sputtering SPU and atomic layer deposition ALD are unified in a single reaction chamber. SPU and ALD are nominally incompatible to each other, which is the main challenge in deposition design.

*IP Issue Date: Jan 4, 2018

*Principal Investigator: Name: Nobuhiko Kobayashi
Department:

Country/Region: USA

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