Thin Film Deposition System: Simultaneous Physical and Chemical Vapor Deposition
- 技术优势
- Simultaneous physical and chemical vapor deposition
- 技术应用
- Thin film deposition systems
- 详细技术说明
- A UCSC researcher has designed various architectures for a system by which physical and chemical vapor deposition are performed simultaneously or sequentially. This disruptive design will have a significate impact on thin film research communities, which will significantly benefit by this new system. Industry could potentially scale up this invention to design a system not currently commercially available.
- *Abstract
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Current commercial thin film deposition systems (e.g. sputtering and atomic layer deposition) allow for only one deposition mode in a single process environment, either physical vapor deposition (PVD) or chemical vapor deposition (CVD. It has been extremely rare, if ever accomplished, that sputtering SPU and atomic layer deposition ALD are unified in a single reaction chamber. SPU and ALD are nominally incompatible to each other, which is the main challenge in deposition design.
- *IP Issue Date
- Jan 4, 2018
- *Principal Investigation
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Name: Nobuhiko Kobayashi
Department:
- 申请号码
- 20180002810
- 其他
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Additional Technologies by these Inventors
Tech ID/UC Case
25617/2015-378-0
Related Cases
2015-378-0
- 国家/地区
- 美国
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