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Tacky Dot® Technologies

Technology Application: These methods are widely applicable and are available for many fields of use.

Detailed Technology Description: As part of the Tacky Dot® donation, the University is offering for commercialization technologies related to improved photo-imageable solder delivery allowing for 3-5 micron diameter solder balls, cleanup of excess particles from an array of Tacky Dots®, materials useful for precise delivery of arrays of particles to substrates, and a new method for reducing tribo-charging that results when solder spheres contact a coated film.

Others: Related Materials
See UCSD Press Release for information on the donation. Use of the trademark can also be made available.

Tech ID/UC Case
21042/2002-092-0

Related Cases
2002-092-0, 2002-823-1, 2002-824-1

*Abstract: None

*Principal Investigator: Name: Ronald Convers
Department:

Name: Ralph Nelson
Department:

Country/Region: USA

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