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Tacky Dot® Technologies
技术应用
These methods are widely applicable and are available for many fields of use.
详细技术说明
As part of the Tacky Dot® donation, the University is offering for commercialization technologies related to improved photo-imageable solder delivery allowing for 3-5 micron diameter solder balls, cleanup of excess particles from an array of Tacky Dots®, materials useful for precise delivery of arrays of particles to substrates, and a new method for reducing tribo-charging that results when solder spheres contact a coated film.
其他
Related Materials Tech ID/UC Case 21042/2002-092-0 Related Cases 2002-092-0, 2002-823-1, 2002-824-1
国家/地区
美国
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