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Micro-device transfer probe enables low cost photonic and electronic integration

Summary
Dirk Englund, Ph.D.
Technology Benefits
Low cost.Easy to operate.Accurate alignment.Capable of single device manipulation.Patent information:Patent PendingTech Ventures Reference: IR CU13062
Technology Application
Transfer of photonic or electronic micro-devices to a silicon substrate.Fabrication of integrated chips with photonic and electronic components.Transfer of various components involved in micro- and nano-fabrication of devices.
Detailed Technology Description
Dirk Englund, Ph.D.
*Abstract
None
*Inquiry
Teresa FazioColumbia Technology VenturesTel: (212) 854-8444Email: TechTransfer@columbia.edu
*IR
CU13062
*Principal Investigator
Country/Region
USA

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