Micro-device transfer probe enables low cost photonic and electronic integration
- 总结
- Dirk Englund, Ph.D.
- 技术优势
- Low cost.Easy to operate.Accurate alignment.Capable of single device manipulation.Patent information:Patent PendingTech Ventures Reference: IR CU13062
- 技术应用
- Transfer of photonic or electronic micro-devices to a silicon substrate.Fabrication of integrated chips with photonic and electronic components.Transfer of various components involved in micro- and nano-fabrication of devices.
- 详细技术说明
- Dirk Englund, Ph.D.
- *Abstract
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None
- *Inquiry
- Teresa FazioColumbia Technology VenturesTel: (212) 854-8444Email: TechTransfer@columbia.edu
- *IR
- CU13062
- *Principal Investigation
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- 国家/地区
- 美国
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