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High Strength Low K Insulators for Integrated Circuits Applications

Detailed Technology Description: None

Countries: Not Available

Application No.: None

*Abstract: A polymer comprises at least two types of monomer units selected from: (1) diethynyl benzene units, (2) triethynyl benzene units, and (3) ester units. After curing, the polymer may form a condensed polyaromatic dielectric having a dielectric constant of at most 2.0 at 1 MHz, an elastic modulus of at least 7.7 GPa, and a hardness of at least 2.0 GPa.

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*IP Issue Date: None

*IP Type: Other Patent

Country/Region: USA

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