High Strength Low K Insulators for Integrated Circuits Applications
- 详细技术说明
- None
- *Abstract
-
A polymer comprises at least two types of monomer units selected from: (1) diethynyl benzene units, (2) triethynyl benzene units, and (3) ester units. After curing, the polymer may form a condensed polyaromatic dielectric having a dielectric constant of at most 2.0 at 1 MHz, an elastic modulus of at least 7.7 GPa, and a hardness of at least 2.0 GPa.
This technology is available for ready-to-sign licensing. Click here.
- *IP Issue Date
- None
- *IP Type
- Other Patent
- 国家
- Not Available
- 申请号码
- None
- 国家/地区
- 美国
欲了解更多信息，请点击 这里
