Method for forming a contact layer having strong adhesion and exceptional uniformity on semiconductor or thermoelectric substrate
- Technology Benefits
- Improved electrical and thermal conductivity at lower cost and higher throughput
- Technology Application
- Manufacturing of various substrates, manufacturing of various micro/nano-structures
- Detailed Technology Description
- None
- *Abstract
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Problem:Difficult to electroplate on low surface energy substratesTechnology:This invention relates to a thin nanoparticle layer or self-assembled monolayer being initially deposited onto a semiconductor or thermoelectric substrate for electroplating an electrically conducting material and having strong adhesion and exceptional uniformity. The invention uses a seed layer that strongly adheres to the substrate to serve as nucleation sites. It is also discovered that these seed layers open up a voltage range such that metals can be selectively deposited onto the predetermined seeded regions only, thus opening new routes for selective area deposition.
- Country/Region
- USA
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