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Method for forming a contact layer having strong adhesion and exceptional uniformity on semiconductor or thermoelectric substrate

技术优势

Improved electrical and thermal conductivity at lower cost and higher throughput

技术应用

Manufacturing of various substrates, manufacturing of various micro/nano-structures

详细技术说明

None

*Abstract

Problem:Difficult to electroplate on low surface energy substratesTechnology:This invention relates to a thin nanoparticle layer or self-assembled monolayer being initially deposited onto a semiconductor or thermoelectric substrate for electroplating an electrically conducting material and having strong adhesion and exceptional uniformity. The invention uses a seed layer that strongly adheres to the substrate to serve as nucleation sites. It is also discovered that these seed layers open up a voltage range such that metals can be selectively deposited onto the predetermined seeded regions only, thus opening new routes for selective area deposition.

国家/地区

美国