ELECTRONIC DEVICES IN PLASTIC
- Summary
- The invention concerns methods for forming an electronic device in plastic. In another aspect, the invention concerns an electronic device formed according to the method.
- Technology Benefits
- Enables the production of electronic components to be housed in unique situations required by Industry.
- Technology Application
- Electronic Manufacturing
- Detailed Technology Description
- The invention concerns a method for forming an electronic device in plastic. The method for forming an electronic device in plastic comprises: (a) placing electronic components in recesses in a thermoplastic substrate; (b) depositing an electronic circuit over the electronic components or onto a thermoplastic sheet; and (c) bonding the thermoplastic substrate with the thermoplastic sheet in a thermal bonding process to seal the electronic components and the electronic circuit between the thermoplastic substrate and the thermoplastic sheet wherein the method further comprises providing a thermally conductive layer on the thermoplastic sheet and/or substrate such that heat applied during the thermal bonding process is distributed uniformly across the thermoplastic sheet and/or substrate to facilitate bonding of the thermoplastic sheet and substrate. In another aspect, the invention concerns an electronic device formed according to the method. It is an advantage that a more uniform heat distribution is achieved.
- Type of Cooperation
- Licensing
- Application Date
- 30/10/2009 00:00:00
- Application No.
- 2009233620
- Country/Region
- Australia
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