ELECTRONIC DEVICES IN PLASTIC
The invention concerns methods for forming an electronic device in plastic. In another aspect, the invention concerns an electronic device formed according to the method.
Enables the production of electronic components to be housed in unique situations required by Industry.
Electronic Manufacturing
The invention concerns a method for forming an electronic device in plastic. The method for forming an electronic device in plastic comprises: (a) placing electronic components in recesses in a thermoplastic substrate; (b) depositing an electronic circuit over the electronic components or onto a thermoplastic sheet; and (c) bonding the thermoplastic substrate with the thermoplastic sheet in a thermal bonding process to seal the electronic components and the electronic circuit between the thermoplastic substrate and the thermoplastic sheet wherein the method further comprises providing a thermally conductive layer on the thermoplastic sheet and/or substrate such that heat applied during the thermal bonding process is distributed uniformly across the thermoplastic sheet and/or substrate to facilitate bonding of the thermoplastic sheet and substrate. In another aspect, the invention concerns an electronic device formed according to the method. It is an advantage that a more uniform heat distribution is achieved.
Licensing
30/10/2009 00:00:00
2009233620
澳洲
