FABRICATION OF ELECTRONIC COMPONENTS IN PLASTIC
- Summary
- This invention relates to the manufacture of electronic circuits using components embossed in a plastic substrate instead of conventional printed circuit boards
- Technology Benefits
- Enables electronic components to be housed in unique situations required by Industry.
- Technology Application
- Electronic Manufacturing
- Detailed Technology Description
- A method of forming electronic components in which a thermoplastic substrate is embossed to create a recess for electronic components; the electronic component is placed in the recess; electrical connections and circuitry are deposited over the components on the thermoplastic substrate; and a cover sheet of thermoplastic material is bonded over the circuitry. The process may also be carried out in reverse order. The apparatus used consists of a hot embossing machine having a former shaped for each particular circuit to be assembled; a pick and place machine with standard reel loading of components; and a screen printer for printing the conductive ink circuitry or a station for adhering conductive tape or preprinted film.
- Type of Cooperation
- Licensing
- Application Date
- 03/07/2006 00:00:00
- Application No.
- 2006265765
- Country/Region
- Australia
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