FABRICATION OF ELECTRONIC COMPONENTS IN PLASTIC
- 总结
- This invention relates to the manufacture of electronic circuits using components embossed in a plastic substrate instead of conventional printed circuit boards
- 技术优势
- Enables electronic components to be housed in unique situations required by Industry.
- 技术应用
- Electronic Manufacturing
- 详细技术说明
- A method of forming electronic components in which a thermoplastic substrate is embossed to create a recess for electronic components; the electronic component is placed in the recess; electrical connections and circuitry are deposited over the components on the thermoplastic substrate; and a cover sheet of thermoplastic material is bonded over the circuitry. The process may also be carried out in reverse order. The apparatus used consists of a hot embossing machine having a former shaped for each particular circuit to be assembled; a pick and place machine with standard reel loading of components; and a screen printer for printing the conductive ink circuitry or a station for adhering conductive tape or preprinted film.
- 合作类型
- Licensing
- 申请日期
- 03/07/2006 00:00:00
- 申请号码
- 2006265765
- 国家/地区
- 澳洲
欲了解更多信息，请点击 这里
