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Process for Assembly of Electronic Devices

IP Title
Process for Assembly of Electronic Devices
Summary

To accommodate the minimization of electronic devices, a novel process for the assembly of electronic devices on flexible substrates has been developed. The technology accommodates chip-on-flex (COF) technology which is well suited to portable display applications. The manufacturing method comprises steps of fixing components to a substrate by an anisotropic conductive film (ACF), applying thermal compression, applying solder to substrate at a contact location, providing a thermal protective cover, and performing a solder reflow process.
Technology Application

•for portable display applications of electronic devices such as mobile phones and personal digital assistants
Application Date
05/12/2007
ID No.
GB2412790B
Country/Region
Hong Kong

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