Process for Assembly of Electronic Devices
Process for Assembly of Electronic Devices
To accommodate the minimization of electronic devices, a novel process for the assembly of electronic devices on flexible substrates has been developed. The technology accommodates chip-on-flex (COF) technology which is well suited to portable display applications. The manufacturing method comprises steps of fixing components to a substrate by an anisotropic conductive film (ACF), applying thermal compression, applying solder to substrate at a contact location, providing a thermal protective cover, and performing a solder reflow process.
•for portable display applications of electronic devices such as mobile phones and personal digital assistants
05/12/2007
GB2412790B
香港
