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Oxidation-Free Silicon Carbide MOSFETs


Summary

PurdueUniversity researchers have developed a SiC surface by depositing gate oxidevs. traditional thermally grown oxide, use a combination of high temperaturehydrogen etching to clean the SiC surface, and either a hydrogen or siliconoxynitride termination structure to preserve and protect the surface prior toatomic layer deposition of the oxide. This technology removes oxidation fromthe process, which is likely responsible for the low mobility of suchstructures. When using a deposited oxide, the surface becomes the interface.This technique provides an ideal surface on which to deposit the gate oxide,resulting in an improvement in interface quality and reduction in channelresistance.


Technology Benefits

Provides solution for low channel mobility Improved interface quality Reduction in channel resistance


Technology Application

Power electronicsLow voltage applications:Hybrid electric vehicles Server farm power suppliesRenewable energy power conversion


Detailed Technology Description

Dallas MorisettePurdue Electrical and Computer Engineering


Countries

United States


Application No.

None


Country/Region

USA

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