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Flexible Penetrating Cortical Multielectrode Array and Manufacturing Methods Thereof

Detailed Technology Description

Engineers from UC San Diego have developed a patent-pending multi-electrode array (MEA) technology that can achieve 3D mapping of cortical tissue while eliciting minimal tissue damage. The enhanced spatial resolution of this technology is 10-100X better than current electrocorticography (ECoG) like sensors and the flexible substrate that holds the MEAs is less than 10 microns in thickness allowing full conformity to the surface of the brain and therefore better connectivity with neural cells in tissue. Furthermore, the fabrication process permits the electrode array to be readily integrated with other electronic devices. This invention has significant promise for single unit recordings from cortical tissues in networks of thousands of neurons.

Application No.

20170231518

Others

State Of Development

The manufacturing method is fully feasible: complete devices have been fabricated. Successfully collected experimental data with these devices including electrochemical impedance spectroscopy measurements and in vivo neural recordings. Details of this invention are available under a secrecy agreement.

Tech ID/UC Case

24469/2014-103-0

Related Cases

2014-103-0

Country/Region

USA

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