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Flexible Penetrating Cortical Multielectrode Array and Manufacturing Methods Thereof

详细技术说明

Engineers from UC San Diego have developed a patent-pending multi-electrode array (MEA) technology that can achieve 3D mapping of cortical tissue while eliciting minimal tissue damage. The enhanced spatial resolution of this technology is 10-100X better than current electrocorticography (ECoG) like sensors and the flexible substrate that holds the MEAs is less than 10 microns in thickness allowing full conformity to the surface of the brain and therefore better connectivity with neural cells in tissue. Furthermore, the fabrication process permits the electrode array to be readily integrated with other electronic devices. This invention has significant promise for single unit recordings from cortical tissues in networks of thousands of neurons.

*Abstract

Signals from neuronal ensembles may be collected from cortical tissue using various multi-electrode array (MEA) designs. To achieve 3D mapping of the brain, scientists have developed penetrating electrodes such as the Michigan and Utah electrodes, however, these large nonflexible electrodes are known to elicit a reactive tissue response in cortical tissue. And while the Michigan and Utah electrodes were successfully used in clinical trials; these devices poorly conform to cortical tissue. Alternatively, conformable bio-integrated electronics have been developed using ultrathin films, but the current devices lack sufficient spatial density to achieve 3D mapping of the cortical tissue.

*IP Issue Date

Aug 17, 2017

*Principal Investigation

Name: Farid Azzazy

Department:

Name: Shadi Dayeh

Department:

Name: Sang Heon Lee

Department:

申请号码

20170231518

其他

State Of Development

The manufacturing method is fully feasible: complete devices have been fabricated. Successfully collected experimental data with these devices including electrochemical impedance spectroscopy measurements and in vivo neural recordings. Details of this invention are available under a secrecy agreement.

Tech ID/UC Case

24469/2014-103-0

Related Cases

2014-103-0

国家/地区

美国