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Enhanced Patterning Of Integrated Circuits
Technology Benefits
One additional step rather than manySelf-aligns to pre-existing surface featuresProduces features smaller than the current resolution limitDoubles the density of featuresFinal feature sizes can be fine-tuned
Technology Application
Producing ICs with complex patternsProducing ICs with increased feature density
Detailed Technology Description
None
Application No.
20180130668
Others
Additional Technologies by these Inventors Tech ID/UC Case 24717/2015-085-0 Related Cases 2015-085-0
Country/Region
USA
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