AsiaIPEX is a one-stop-shop for players in the IP industry, facilitating IP trade and connection to the IP world. Whether you are a patent owner interested in selling your IP, or a manufacturer looking to buy technologies to upgrade your operation, you will find the portal a useful resource.

Back to search results

Control of grain size, shape, and boundary location in semiconductor thin films using pulsed laser melting

Summary

James Im, Ph.D..

Technology Benefits

Can manufacture thin film metal layers for semiconductor applications while removing the problem of electromigrationPrecise control over grain size, shape, and boundaries in the thin film Incorporation of a beam mask and translation stage allows for quick and precise control over the area that is exposed to the laser irradiation.Patent information:Patent Issued (WO/03084688)Patent Issued (US7,399,359)Tech Ventures Reference: IR M01-050

Technology Application

Control grain properties in thin film semiconductors for research applicationsConvert amorphous metals to crystalline layers without high temperatureManufacture single crystalline metal layers, including aluminum and copper, for applications in the photovoltaic and display industries.

Detailed Technology Description

James Im, Ph.D..

Country/Region

USA

For more information, please click Here