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Electrothermal Interface Material Enhancer on Thin Flexible Substrates

Summary

Researchers at Purdue University have developed a process that does not require either chemicals or high temperatures to bond CNTs to an opposite surface; they can even bond to glass. This breakthrough results in better contact for both improved heat transfer and electrical conduction. Increased heat transfer increases heat sync efficiency, allowing devices to operate at lower temperatures. This method of applying CNTs allows use on materials that would have been damaged by older, limited, inefficient application techniques.

Technology Benefits

Increased contact with surface More efficient heat transfer

Technology Application

Processor chips or integrated circuit devices Connected electrical devices that require electricity to pass between the devices

Detailed Technology Description

Timothy FisherNanoscale Transport Research GroupPurdue Mechanical Engineering

Countries

United States

Application No.

8,919,428

Country/Region

USA

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