Electrothermal Interface Material Enhancer on Thin Flexible Substrates
- 總結
- Researchers at Purdue University have developed a process that does not require either chemicals or high temperatures to bond CNTs to an opposite surface; they can even bond to glass. This breakthrough results in better contact for both improved heat transfer and electrical conduction. Increased heat transfer increases heat sync efficiency, allowing devices to operate at lower temperatures. This method of applying CNTs allows use on materials that would have been damaged by older, limited, inefficient application techniques.
- 技術優勢
- Increased contact with surface More efficient heat transfer
- 技術應用
- Processor chips or integrated circuit devices Connected electrical devices that require electricity to pass between the devices
- 詳細技術說明
- Timothy FisherNanoscale Transport Research GroupPurdue Mechanical Engineering
- *Abstract
-
- *Background
- The current methodology of growing carbon nanotubes (CNTs) between two surfaces requires chemicals and high temperatures. The CNTs produced in this manner result in free tips not in ideal contact with the opposing surface.
- *IP Issue Date
- Dec 30, 2014
- *IP Type
- Continuation
- *Stage of Development
- Prototype testing
- *Web Links
- Purdue Office of Technology CommercializationPurdueInnovation and EntrepreneurshipTim FisherNanoscale Transport Research GroupPurdue Mechanical Engineering
- 國家
- United States
- 申請號碼
- 8,919,428
- 國家/地區
- 美國
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