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Shell-Activated Sintering of Core-Shell Particles
Summary
Purdue University researchers have developed a new interconnect technology based on low temperature sintering, replacing traditional solder joints, as well as high Pb and silver solder alloys, used for high temperature attach of semiconductor die to substrate. This technology lowers the processing temperature, improves interconnect characteristics, and minimizes the tin "whiskers."
Technology Benefits
Improved interconnect characteristicsMinimizes tin "whiskers"
Technology Application
MaterialsManufacturing
Detailed Technology Description
Carol HandwerkerDesign LabPurdue Materials Engineering
Countries
United States
Application No.
None
Country/Region
USA
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