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Polymer-Based Heterogeneous Integration Technology
Summary
Researchers at Purdue University have developed a new approach to remove the packaging and bulky passive elements from expensive active chips and fabricate them within a less expensive carrier substrate; therefore, reducing the cost of the integrated system.
Technology Benefits
Reduces size and costDecreases parasitic capacitance More reliable and efficient
Technology Application
MaterialsManufacturingMicroelectronicsNanoelectronics
Detailed Technology Description
Saeed MohammadiPurdue Electrical and Computer Engineering
Countries
United States
Application No.
7,473,579
Country/Region
USA
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