AsiaIPEX is a one-stop-shop for players in the IP industry, facilitating IP trade and connection to the IP world. Whether you are a patent owner interested in selling your IP, or a manufacturer looking to buy technologies to upgrade your operation, you will find the portal a useful resource.

Back to search results

Electrowetting Based Pick and Place Assembly Device

Detailed Technology Description: A material handling device based on electrowetting was designed for high-volume assembly of micron-sized objects.

Others: Patent application: PCT/US13/50650

*Abstract: A material handling device based on electrowetting was designed for high-volume assembly of micron-sized objects. The device includes a flat plate with an array of electrically controlled nodes that switch their adhesion property based on the voltage supply. Designed to accurately pick up and place millions of micro-meso tiles in parallel, the system is also low-maintenance and self-cleaning due to the adhesion-switching approach. This novel technology has application primarily to assist 3D printers in assembly but could also be applied to heavy objects.

*Licensing: Jessica Lyga jml73@cornell.edu (607) 255-0270

Country/Region: USA

For more information, please click Here