Electrowetting Based Pick and Place Assembly Device
- 详细技术说明
- A material handling device based on electrowetting was designed for high-volume assembly of micron-sized objects.
- *Abstract
-
A material handling device based on electrowetting was designed for high-volume assembly of micron-sized objects. The device includes a flat plate with an array of electrically controlled nodes that switch their adhesion property based on the voltage supply. Designed to accurately pick up and place millions of micro-meso tiles in parallel, the system is also low-maintenance and self-cleaning due to the adhesion-switching approach. This novel technology has application primarily to assist 3D printers in assembly but could also be applied to heavy objects.
- *Licensing
- Jessica Lyga jml73@cornell.edu (607) 255-0270
- 其他
-
Patent application: PCT/US13/50650
- 国家/地区
- 美国
欲了解更多信息，请点击 这里
