Shell-Activated Sintering of Core-Shell Particles
- Summary
- Purdue University researchers have developed a new interconnect technology based on low temperature sintering, replacing traditional solder joints, as well as high Pb and silver solder alloys, used for high temperature attach of semiconductor die to substrate. This technology lowers the processing temperature, improves interconnect characteristics, and minimizes the tin "whiskers."
- Technology Benefits
- Improved interconnect characteristicsMinimizes tin "whiskers"
- Technology Application
- MaterialsManufacturing
- Detailed Technology Description
- Carol HandwerkerDesign LabPurdue Materials Engineering
- Countries
- United States
- Application No.
- None
- *Abstract
-
- *Background
- Although consumer electronics have transitioned almost entirely to lead (Pb)-free solder interconnects, the new Pb-free interconnects have lower performance characteristics and require higher processing temperatures compared to their Pb-containing predecessor. These new interconnects also have the propensity to form tin "whiskers" that increase the risk of short circuits.
- *IP Issue Date
- None
- *IP Type
- Divisional
- *Stage of Development
- Concept Developed
- *Web Links
- Purdue Office of Technology CommercializationPurdueInnovation and EntrepreneurshipCarol HandwerkerDesign LabPurdue Materials Engineering
- Country/Region
- USA
For more information, please click Here
