Electroplating-based flip chip solder preparation process had been widely used over other preparation methods. Although it is cheaper and is able to achieve the material deposition on the fine pitch I/O pads, the solder bumps resulted are not uniform and not quality-guaranteed. In this invention, ma.....
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The present invention discloses a low temperature poly-Si technique employing the furnace annealing process, which can bring about high quality poly-Si films with as good performance as the high temperature poly-Si or the laser-crystallized poly-Si. Employing doped poly-Si lines in widths of hundred.....
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The demand for high quality and high information content liquid crystal display (LCD) and Organic Light-Emitting Diode (OLED) display has been driving the switch from passive to active matrix (AM) panels. For small size, high information-content, high functional integration and low-power consumption.....
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