微组装技术主要包括电路基板制造和组装封装技术。其中，高密度多层电路基板制造技术主要包括薄膜技术和后膜技术。目前，已成功开发了切片机、生瓷带打孔机、微孔填充机、精密网版印刷机、叠片机、热切机、LTCC 烧结炉等LTCC 工艺线的整套关键设备和部分薄膜多层基板制造、芯片凸点制造等20 余种关键设备。已具备微电子高密度多层基板制造集成工艺基本解决方案的能力和提供LTCC生产线整套关键设备的能力。目前已经处于产业化初期阶段，已经成功建设两条生产线，并成功运行，先后获得中国电子科技集团公司科技进步奖4 项，后的20余项专利授权（其中发明专利11 项）。知识产权状况及获奖情况：1、共晶压力精确调节结构（2.....
[Detail]
The Invention Provides Suppressing Tumor Cell Growth In A Patient, Comprising: Administering To The Patient An Effective Amount Of An Expression Vector Including A Polynucleotide Encoding A Tumor Suppressor Protein Having Seq Id No: 1 Under Conditions Wherein The Expression Vector Incorporates Itsel.....
[Detail]
A tricolor LED display system (10) is provided having a plurality of multi-color LEDs (22) that operate as concurrent display and data communication elements. These dual-use tricolor LEDs are coupled to a special-purpose computer system (12) and audio signal transmitter (16) for simultaneously contr.....
[Detail]
A tricolor LED display system (10) is provided having a plurality of multi-color LEDs (22) that operate as concurrent display and data communication elements. These dual-use tricolor LEDs are coupled to a special-purpose computer system (12) and audio signal transmitter (16) for simultaneously contr.....
[Detail]
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