Electroplating-based flip chip solder preparation process had been widely used over other preparation methods. Although it is cheaper and is able to achieve the material deposition on the fine pitch I/O pads, the solder bumps resulted are not uniform and not quality-guaranteed. In this invention, ma.....
[Detail]
Well-known magnetometers and magnetic field sensors employing semiconductor materials are usually either not compatible with standard integrated circuit (IC) fabrication techniques, or are not sufficiently sensitive for practical usage. Currently, in order to obtain the required sensitivity, materia.....
[Detail]
The demand for high quality and high information content liquid crystal display (LCD) and Organic Light-Emitting Diode (OLED) display has been driving the switch from passive to active matrix (AM) panels. For small size, high information-content, high functional integration and low-power consumption.....
[Detail]
This invention is about three new measuring methods to determine the twist angle and retardation value of any twisted nematic liquid crystal cell. Twist angle of the liquid crystal alignment and the retardation value are important design parameters in determining the optical performance of liquid c.....
[Detail]
The demand for high quality and high information content liquid crystal display (LCD) and Organic Light-Emitting Diode (OLED) display has been driving the switch from passive to active matrix (AM) panels. For small size, high information-content, high functional integration and low-power consumption.....
[Detail]
| |< <- | [10] [11] [12] [13] [14] [15] [16] [17] [18] [19] [20] | -> >| |
