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This invention describes a process for manufacturing high precision structures on silicon substrates. These structures can be used in applications such as integrated optical devices and biomedical sensors. This process enables the user to manufacture high volumes with low capital investments. Furthe..... [Detail]
A novel process was developed for lithographically patterning a material on a substrate that greatly reduces wastes to provide a much more environmentally and economically friendly microelectronics fabrication method. [Detail]
Application No.: 14/759,478In the present Incoherent Type-III (hereinafter referred to as “IT3”) junction, equilibrium is reached when the two sides are aligned. Therefore, the junction is at zero-voltage, allowing operation as a rectifying junction at a very low voltage. Whereas the PN-junction has..... [Detail]
A novel on-chip spectrometer capable of analyzing light with sub-nanometer resolution was developed. [Detail]
Group III-Nitride compositions have been developed that are suitable for spin coating on large substrates. [Detail]
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