Network On Interconnect Fabric

NoIF is a novel wafer-level framework to support heterogeneous, ultra large-scale integration.

NoIF offers a wafer-level framework to enable multiple services, including global and semi-global communication, power delivery, conversion, and management, synchronization, testing and more.

Researchers at UCLA have developed a novel network on interconnect fabric (NoIF), which enables integration of ultra large-scale heterogeneous systems within the technologically mature Si-IF platforms. NoIF is based on utility dies that serve as intelligent nodes within the network.

State Of Development

Conceptual stage.

Background

Modern systems contain a variety of heterogeneous circuit blocks, and require ultra large-scale integration to accommodate different applications. Ideally, silicon interconnect fabric (Si-IF) is a compatible platform to satisfy the needs of modern systems through supporting integration of bare (unpackaged) dies using thermal compression bonding on a Si wafer substrate. Fine pitch horizontal and vertical interconnects are feasible within the Si-IF using standard Si processing techniques. However, to enable the Si-IF as a practical platform for ultra large-scale heterogeneous integration, system-level issues, similar to a large system on a chip, must be addressed.

Related Materials

B. Vaisband, A. Bajwa, and S. S. Iyer, Network on Interconnect Fabric, Proceedings of the IEEE International Symposium on Quality Electronic Design, March 2018.

Additional Technologies by these Inventors

• Trademark: Flexible Fan Out Wafer Processing And Structure: Flextrate
• Power Distribution within Silicon Interconnect Fabric
• Flexible And Stretchable Interconnects For Flexible Systems And Flextrate(Tm)
• Intelligent Flexible Spinal Cord Stimulators For Pain And Trauma Management Through Neuromodulation

Tech ID/UC Case

29596/2018-220-0

Related Cases

2018-220-0

USA