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Compact Wafer Based Ion Accelerator

Detailed Technology Description
We offer a new approach, using industry standard fabricationmethods, enabling the fabrication of compact RF-based particle accelerators forthe generation of high intensity ion beams.
Others

Publications

· K.B.Vinayakumar et.al. “Waferscale Electrostatic Quadrupole Array for Multiple IonBeam Manipulation”, arXiv preprint 7 Feb 2018 https://arxiv.org/abs/1802.02622

· P.A.Seidl et.al. “Demonstration of a compact linear accelerator”, arXiv preprint 1 Feb 2018 https://arxiv.org/abs/1802.00173

· “MEMSBased Ion Beam Drivers for Magnetized Target Fusion” ARPA-E Annual ReviewAugust 2017 https://arpa-e.energy.gov/sites/default/files/08_SCHENKEL.pdf

· A. Persaud et. al. “A compact linear accelerator based on ascalable microelectromechanical-system RF-structure” Review of ScientificInstruments 88, 063304 (2017). doi: 10.1063/1.4984969

· A. Persaud et. al. “Staging of RF-accelerating Units in aMEMS-based Ion Accelerator” Physics Procedia, 90, 2017 pp 136-142. https://doi.org/10.1016/j.phpro.2017.09.040

*Abstract

We have developed a compact particle acceleratorfabricated using PCB or wafer fabrication techniques. Our accelerator designuses radio frequency (RF) technology to accelerate ions in several stages,allowing use of relatively low (1kV) applied voltages. Compared to existingaccelerators, our design can reduce accelerator cost and size by orders ofmagnitude.

 

Using conventional silicon micro-fabrications techniques our prototype, shown below,includes a 3x3 grid of ~1mm apertures which help focus the ion beams using pairsof electrostatic quadrupoles, the poles being arranged around the apertures.

 

In the schematic (below), multiple accelerating waferscan be stacked linearly, the stack of wafers includes a beam matching sectionas well as the MEMS based focusing wafer resulting in a compact system andminimizing fabrication costs. This design can be scaled to larger arrays (e.g.20 X 20) or by adding additional wafers allowing orders of magnitude variationin current densities while maintaining a comparatively small overall footprint.

 

Basedon our promising proof-of-concept results, this ion accelerator can beimplemented for applications diverse areas ranging from high beam power neededfor future Tokamak reactors to smaller scale applications including massspectrometers and surface treatment of materials.

 

PotentialApplications

  • Mass Spectrometry
  • Neutron Generators
  • X-Ray Generators
  • Surface Treatment
  • Ion Implantation
  • Plasma Diagnostics
  • Fusion Plasma Heating (e.g. Tokamak)

 

Advantages

  • Requires low applied voltages
  • Can be stacked inline to allow higher beam energy
  • Scalable for diverse applications
  • Smaller space requirements compared to existing accelerators
  • Uses standard wafer and PCB manufacturing methods
*Licensing
Patrick Govangpjg26@cornell.edu1-607-254-2330
Country/Region
USA

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