Reworkable Underfill and/or Encapsulants for Microelectronics Packaging
- Detailed Technology Description
- This novel class of reworkable thermosets based on substituted cyclic hydrocarbon moieties offers significant advantages for electronic packaging applications.
- *Abstract
-
This novel class of reworkable thermosets based on substituted cyclic hydrocarbon moieties offers significant advantages for electronic packaging applications. The resins of this invention retain the desirable insulating capability and mechanical properties of current commercially available materials, but can be thermally decomposed at a lower temperature. Decomposition residues can then be removed using commonly available solvents, without damaging the underlying electronic components. Usable for both encapsulation and underfill, the thermoset resins of this invention will allow repair, replacement, recovery, or recycling of operative electronic components from assemblies which have become inoperative. These superior properties enable the customers to use these polymers as encapsulation and underfill materials.
Potential Applications
- Underfill and encapsulation material for microelectronics packaging
Advantages
- Low moisture adsorption
- Shock and vibration resistance
- Good adhesion to the chip and board
- Maintains insulating properties
- Decomposes at low temperature
- *Licensing
- Martin Teschlmt439@cornell.edu(607) 254-4454
- Country/Region
- USA
