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Lateral Growth Method for Defect Reduction of Semipolar Nitride Films


Technology Benefits

Reduced defect density in semipolar nitride films Can be performed multiple times to further decrease dislocation density


Technology Application

Growth of semipolar nitride films    This technology is available for a non-exclusive license. See below for a selection of the patents and patent applications related to this invention. Please inquire for full patent portfolio status.


Detailed Technology Description

Researchers at the University of California, Santa Barbara have developed a novel method for defect reduction via lateral growth of semipolar nitrides. Lateral growth can be used to reduce defect density in semipolar nitride films by such growth techniques as LEO, SLEO, cantilever epitaxy, and nanomasking. The lateral growth can also be performed multiple times to further decrease the dislocation density.


Supplementary Information

Patent Number: US8148244B2
Application Number: US2006486224A
Inventor: Baker, Troy J. | Haskell, Benjamin A. | Speck, James S. | Nakamura, Shuji
Priority Date: 13 Jul 2005
Priority Number: US8148244B2
Application Date: 13 Jul 2006
Publication Date: 3 Apr 2012
IPC Current: H01L002120 | H01L002136
US Class: 438481 | 257E21133
Assignee Applicant: The Regents of the University of California | Japan Science and Technology Agency
Title: Lateral growth method for defect reduction of semipolar nitride films
Usefulness: Lateral growth method for defect reduction of semipolar nitride films
Summary: For reducing defects in semipolar nitrides films in fabrication of devices (claimed), particularly semiconductor films.
Novelty: Reducing defect for semipolar nitride film useful e.g. in semiconductor films involves performing lateral growth of semipolar nitride over mask or gaps to reduce defect density in the semipolar nitride


Industry

Electronics


Sub Group

Semiconductor


Application No.

8148244


Others

Background

As bulk GaN crystals are not widely available, current devices are grown on foreign substrates heteroepitaxially. The nature of heteroepitaxial growth leads to significant defect densities, most prominently in the form of threading dislocations. Researchers are continually trying to reduce defect density. In c-plane nitride growth, as well as other semiconductor materials systems, the threading dislocation defects predominantly propagate along the principal growth direction. As such, laterally growing polar and nonpolar nitrides tend to exhibit reduced defect densities.


Additional Technologies by these Inventors


Tech ID/UC Case

21918/2005-672-0


Related Cases

2005-672-0


Country/Region

USA

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