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Method For Producing High-Efficiency Thermal Materials With Graphene And Metal Fillers

Technology Benefits
This revolutionary new technology in thermal interface materials can be applied to a variety of devices, batteries, and systems that face the significant problem of self-heating and efficient removal of that heat.
Detailed Technology Description
Schematic illustrating the action of thermal interface material, which fills the gaps between two contacting surfaces. The heat removal improves with higher thermal conductivity, smaller bond line thickness and contact resistance of the material. The method developed at UCR allows one for significant increase of the effective thermal conductivity of TIMs and reduction of the overall thermal resistance.
Application No.
9716299
Others

Related Technologies


Tech ID/UC Case

22858/2013-156-2


Related Cases

2013-156-2, 2013-224-0, 2013-812-0, 2014-245-0, 2014-246-0

*Abstract
University of California researchers have developed an optimized mixture of graphene and multilayer graphene that utilizes high-yield liquid phase exfoliation techniques to significantly increase the thermal conductivity of thermal interface materials.  While current thermal interface materials have thermal conductivity values in the range of ~1 to 5 W/mK at room temperature, University of California researchers have achieved thermal conductivity values at or above 25 W/mK at room temperature with only small graphene loading fractions at 5% by volume.  The graphene and few layer graphene are utilized as filler materials with various base (or matrix) materials to form the thermal interface materials.  
*IP Issue Date
Jul 25, 2017
*Principal Investigator

Name: Alexander Balandin

Department:

Country/Region
USA

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