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Improved Rapid Bonding Of Silicon To Steel

Technology Benefits

Cool enough to prevent damage to the bonded partsFast enough for cost-effective assembly line manufacturing

Technology Application

Bonding silicon based sensors and circuits to steel-based devices and structures -- for example, bonding a MEMS strain sensor to rolling element bearing enabling the in-situ sensing of road conditions and bearing wear.

Detailed Technology Description

None

Supplementary Information

Patent Number: US7452800B2
Application Number: US2006598244A
Inventor: Sosnowchik, Brian D. | Lin, Liwei | Pisano, Albert P.
Priority Date: 9 Nov 2005
Priority Number: US7452800B2
Application Date: 9 Nov 2006
Publication Date: 18 Nov 2008
IPC Current: H01L002144
US Class: 438615 | 257E21084
Assignee Applicant: The Regents of the University of California
Title: Bonding a non-metal body to a metal surface using inductive heating
Usefulness: Bonding a non-metal body to a metal surface using inductive heating
Summary: For bonding a non-metal body to a metal surface, e.g. for bonding silicon chip to steel for sensor applications.
Novelty: Non-metal body to metal surface bonding, e.g. silicon chip to steel for sensor applications, comprises inductive heating of heat-activated bonding agent to bond non-metal body to metal surface

Industry

Chemical/Material

Sub Group

Metal Material

Application No.

7452800

Others

Related Technologies

Simplified Oscillator Circuit Design For Resonators

Tech ID/UC Case

17566/2005-131-0

Related Cases

2005-131-0

Country/Region

USA

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