Method For Constructing Structures Using Nanoparticles
- Technology Benefits
- Superior fabrication flexibility, reliability and economics due to the elimination of substrate recesses
- Technology Application
- Metallic and non-metallic structure generationMEMSSuperconductors
- Detailed Technology Description
- None
- Supplementary Information
- Patent Number: US7087523B2
Application Number: US2003621046A
Inventor: Grigoropoulos, Constantine P. | Bieri, Nicole Renée | Poulikakos, Dimos | Chung, Jaewon
Priority Date: 10 Jan 2001
Priority Number: US7087523B2
Application Date: 16 Jul 2003
Publication Date: 8 Aug 2006
IPC Current: H01L002144 | H01L002148 | H01L0021768 | H05K000310 | H05K000312
US Class: 438662 | 257E21582 | 438962
Assignee Applicant: The Regents of the University of California
Title: Method for producing a structure using nanoparticles
Usefulness: Method for producing a structure using nanoparticles
Summary: For forming e.g. polymer structure on substrate such as semiconductor wafer, using nanoparticles of gold in liquid e.g. toluene, terpineol, xylene, water, used for desktop production of simple electrode components, wire bonding.
Novelty: Substrate structure formation method, involves depositing liquid suspension of gold nanoparticles on substrate and solidifying partially molten nanoparticles
- Industry
- Electronics
- Sub Category
- Semiconductor
- Application No.
- 7087523
- Others
-
Related Technologies
Tech ID/UC Case
17086/2001-108-0
Related Cases
2001-108-0
- *Abstract
-
Using nanoparticles to construct microstructures on silicon chips is emerging as an important technique because of the comparatively low melting point of the nanoparticles. However, current construction methods require the presence of suitable substrate surface recesses that consequently hinder fabrication flexibility.
To eliminate the need for substrate recesses, researchers at the UC Berkeley have developed a new process for constructing microstructures with nanoparticles. This method utilizes a laser light to partially melt nanoparticles, and upon solidification, the molten particles are sintered together to form the desired structure. Due to the low melting point of nanoparticles compared to that of bulk materials, this procedure avoids damage to the substrate and provides superior control over the structure construction process.
This innovative technology can be used with a variety of delicate substrate materials in a normal atmospheric environment yielding a user friendly, fast, and cost effective process. This method has a wide array of metallic and non-metallic applications including formation of interconnections, MEMS, and superconductors.
- *IP Issue Date
- Aug 8, 2006
- *Principal Investigator
-
Name: Nicole Bieri
Department:
Name: Jaewon Chung
Department:
Name: Costas Grigoropoulos
Department:
Name: Seung-Hwan Ko
Department:
Name: Heng Pan
Department:
Name: Dimos Poulikakos
Department:
- Country/Region
- USA
