Microneedles Formed Vertically Within A Semiconductor Substrate
- Technology Benefits
- Needles may be formed with various slopes and tip shapes for specific applicationsNeedle arrays may be fabricatedProduces low cost and highly reproducible structures
- Technology Application
- Transdermal drug deliveryInjection or extraction of gases, fluids or suspensionsNeedle arrays may be used to pattern a structureInterface with instrumentation
- Detailed Technology Description
- None
- Supplementary Information
- Patent Number: US6406638B1
Application Number: US2000478913A
Inventor: Stoeber, Boris | Liepmann, Dorian
Priority Date: 6 Jan 2000
Priority Number: US6406638B1
Application Date: 6 Jan 2000
Publication Date: 18 Jun 2002
IPC Current: B81C000100 | A61M0005158 | A61M000532 | A61M003700 | B81B000100 | H01L002166
US Class: 216011 | 216002 | 216049 | 216079 | 438712 | 438713 | 438719
Assignee Applicant: The Regents of the University of California
Title: Method of forming vertical, hollow needles within a semiconductor substrate, and needles formed thereby
Usefulness: Method of forming vertical, hollow needles within a semiconductor substrate, and needles formed thereby
Summary: The method is used for forming a needle which is used for biomedical applications used to inject gases, fluids, suspensions and for extracting gases, and liquid and also employed in instrumentation and for guiding electromagnetic waves.
Novelty: Needle fabrication for biomedical application, comprises forming a channel and vertical axial surface in back and front sides of a substrate by anisotropic and isotropic etching, respectively
- Industry
- Electronics
- Sub Category
- Semiconductor
- Application No.
- 6406638
- Others
-
Tech ID/UC Case
16918/2000-043-0
Related Cases
2000-043-0
- *Abstract
-
Traditionally, needles for biomedical applications have been fabricated from stainless steel. Recently techniques have been developed for forming needles from semiconductor materials, usually in the horizontal plane of a semiconductor substrate. Researchers at the University of California, Berkeley have developed an improved needle fabrication method, whereby needles are formed vertically in a semiconductor substrate.
Using standard microfabrication techniques, needles may be formed with various vertical slopes and the needle tips may be formed in a variety of shapes. For example, a combination of isotropic and anisotropic etching is used to produce needles with steep vertical walls, while istropic etching alone is used to produce needles wth sloping vertical walls that terminate in wide bases to withstand relatively large lateral forces. Needles of various lengths and diameters may be formed; representative dimensions are 200 microns in length and 25 microns in diameter.
Regents' patent rights in the vertically-formed needles includes the method of forming the needles and the needles formed thereby.
- *IP Issue Date
- Jun 18, 2002
- *Principal Investigator
-
Name: Dorian Liepmann
Department:
Name: Boris Stoeber
Department:
- Country/Region
- USA
