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Compact on-chip sensor for circuit thermal monitoring

Summary

This technology is an ultra-compact and power-efficient on-chip sensor for dense thermal monitoring in digital very-large-scale-integration (VLSI) systems.

Technology Benefits

Smaller on-chip footprint Greater post-calibration accuracyEnhanced voltage scalability

Technology Application

Multi-core microprocessorsSystem-on-Chip circuitsGraphics process units (GPUs)Low-power integrated circuits for mobile devicesImplanted biomedical devices integrated circuitsRemote wireless sensing chipsSystems requiring ultra-dynamic voltage scalingSystems using dynamic thermal management in conjunction with machine learning

Detailed Technology Description

None

*Abstract

None

*Inquiry

Greg MaskelColumbia Technology VenturesTel: (212) 854-8444Email: TechTransfer@columbia.edu

*IR

CU15295

*Principal Investigator

*Publications

Teng Y, Seongjong K, Peter K, Mingoo S. “Compact and Supply-Voltage-Scalable Temperature Sensors for Dense On-Chip Thermal Monitoring” IEEE Journal of Solid-State Circuits. 2015 Oct 07;50(11):2773-2785. Seongjong K, Mingoo S. “A 30.1μm², < ±1.1°C-3σ-error, 0.4-to-1.0V temperature sensor based on direct threshold-voltage sensing for on-chip dense thermal monitoring” Custom Integrated Circuits Conference. 2015 Sept;1-4. Teng Y, Seongjong K, Peter K, Mingoo S. “16.4 0.6-to-1.0V 279μm², 0.92μW temperature sensor with less than +3.2/-3.4°C error for on-chip dense thermal monitoring” 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers. 2014 Feb;282-283 Tech Ventures Reference:IR CU15295Licensing Contact: Greg Maskel

Country/Region

USA