Electrical signal and power source integration method for diverse 3D multi-chip stacks
- Summary
- Kenneth Shepard, Ph.D.
- Technology Benefits
- Allows greater flexibility in the design and production of complex electronics.Reduces cost and complexity of multifaceted chip design Enables greater miniaturization, better noise and signal isolationDelivers more efficient power and signal transfer.Improves overall performance of stack by pairing analog components with digital processors.Confers flexibility for placement of control circuitry in stack.Patent information:Patent Pending
- Technology Application
- Integrates chips used for micro- and nano-electromechanical systemsEnables laser drivers to cooperate with opto-electronics and photonic devices for single-photon sources, semiconductor laser diodes, or vertical cavity surface-emitting lasers.Separates analog and digital circuitry prevalent in everyday devices, i.e. cell phones and laptop computers.Expands to applications involving integrated voltage regulators, analog high-speed serial links, clock synthesis, and other types of voltage and power control models.
- Detailed Technology Description
- Kenneth Shepard, Ph.D.
- *Abstract
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None
- *Inquiry
- Jay HickeyColumbia Technology VenturesTel: (212) 854-8444Email: TechTransfer@columbia.edu
- *IR
- CU12054
- *Principal Investigator
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- *Publications
- N. Sturcken, M. Petracca, S. Warren, L. P. Carloni, A. V. Peterchev and K. L. Shepard. An integrated four-phase buck converter delivering 1A/mm2 with 700ps controller delay and network-on-chip load in 45-nm SOI. Custom Integrated Circuits Conference (CICC), September, 2011, pp. 1-4. Further Information: Columbia | Technology VenturesJay Hickey; Tel: (212) 854-6521Email: TechTransfer@columbia.edu
- Country/Region
- USA
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