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Improved Wafer for Raman Spectroscopy

Detailed Technology Description: None

Countries: Not Available

Application No.: None

*Abstract: Researchers from the University of Illinois have developed a nanostructure and a method of creating that nanostructure for use in Raman Spectroscopy. The wafer is fabricated using thermal dewetting, allowing for a scalable and repeatable surface for use in surface plasmon resonance techniques. It results in a greater than 10^9 wafer enhancement factor, compared to a 10^6 enhancement factor compared to other wafers made from similar techniques.

*IP Issue Date: None

*IP Type: Other Patent

Country/Region: USA

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