Patterning Methods for Stretchable Structures
- Detailed Technology Description
- Described herein are processing techniques for fabrication of stretchable and/or flexible electronic devices using laser ablation patterning methods.
- Countries
- Not Available
- Application No.
- None
- *Abstract
-
Described herein are processing techniques for fabrication of stretchable and/or flexible electronic devices using laser ablation patterning methods. The laser ablation patterning methods utilized herein allow for efficient manufacture of large area (e.g., up to 1 mm.sup.2 or greater or 1 m.sup.2 or greater) stretchable and/or flexible electronic devices, for example manufacturing methods permitting a reduced number of steps. The techniques described herein further provide for improved heterogeneous integration of components within an electronic device, for example components having improved alignment and/or relative positioning within an electronic device. Also described herein are flexible and/or stretchable electronic devices, such as interconnects, sensors and actuators.
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- *IP Issue Date
- None
- *IP Type
- Other Patent
- Country/Region
- USA
